The chip capacitor will fail during the working process, so what is the reason and what is the solution? Today, Jinsheng Xiaobian will discuss it with you.

1, in the installation process, if the nozzle pressure of the installation machine is too large to bend, it is easy to deformation and crack, this situation is actually relatively rare, but once there is a problem, the proportion of batch failures will be large.

2. The chip capacitor is too close to the edge of the printed circuit board, causing internal fracture of the capacitor after stress. Solution: Improve the cloth plate, capacitor as far as possible parallel to the edge or away from the edge; Adopting mechanical sub-formwork; Deepen the micro-cutting depth to 1/3; Add grooves to facilitate template splitting. In fact, grooving is the most reliable method. Note that if the chip capacitor is too close to the edge, even if the slot space is not enough, then the other side of the slot is the same effect. Note that the groove width should not be too small, too small, the supplier can not process, generally at least 1 mm.

3. The chip capacitor pad is connected with the nearby large solder joint. During the welding process, due to the thermal expansion thrust, the shrinkage generates tension during the solidification process, which easily leads to capacitor cracking. Sometimes, in large electrolysis, it is more convenient to use high frequency discharge of chip capacitor and chip resistance discharge. In doing so, the chip capacitor is likely to fail, too close to the large electrolysis. Replacing a chip capacitor with a chip capacitor can avoid this problem.

4, the thermal shock in the welding process and the deformation of the matrix after welding are easy to produce cracks. In the process of capacitor wave soldering, the preheating temperature, insufficient time or high welding temperature are easy to crack.

5, in the manual repair welding process, the welding head is directly in contact with the ceramic body of the capacitor, and its capacity will cause cracks. The deformation of the base after welding (such as cracking, installation, etc.) is also prone to cracks.

The above is the fault in the production process, and it is necessary to pay attention to the voltage and capacitance values of the chip capacitor:

1, as the capacitance value of VCC capacitor (UF level), try to choose foreign brands such as TDK capacitors or increase the voltage value of domestic capacitors by one level.

2, try not to choose high-voltage large-capacity chip capacitors, such as 100V/100nF capacitor. In general, as long as we pay attention to the design and production, we can avoid the failure of most chip capacitors.

The above is the small series to share today, I hope to help you!